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SMT/BGA Rework with Pre-Heaters: The Chipmaster Radiant provides a wide area preheat solution, which gradually and uniformly maintains a temperature sufficient to stabilize the PCB prior to and during the rework operation. This constant total area heat stabilization is not possible with bottom focal preheat systems. The Flo-Master BGA/SMT rework and repair engine is a fully integrated dual, top and bottom heat system designed to handle BGA's, military-type boards, and commercial applications requiring an efficient level of power vs. temperature. The Flo-Master II is the second system in the Flo-Master family, with integrated features required for computer profiling of larger PCB's. The Flo-Master II should be considered for PCB's greater than 12" x 14". The third system in the Flo-Master family is the Flo-Master III. This machine is designed for the largest PCB types, which require extreme high energy bottom heat to assist in low temperature reflow. |
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