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Thru-Hole Rework: The ideal desoldering station for sensitive electronic circuits. Features a three digit LED readout displaying temperature setting and reading and operator lock out system. Continuous vacuum is achieved through an in-house air supply filtered and regulated from 60-120 psi and PNEU-VAC foot pedal activating a venturi system for an instant vacuum force of 20-23"Hg, ideal for multi-layer joints of high thermal mass and tight lead to hole clearance. Includes pencil grip EX1700 static dissipative handpiece to protect sensitive components. Meets all applicable military standards of EOS/ESD requirements. The EX 750 REPAIR AND MANUFACTURING SYSTEM is the ideal station for sensitive expensive electronic circuit. The EX 750 is a surface mount and conventional component repair and rework station. Tip temperature is electronically controlled from 450° F to 900° F. Two programmable digital controllers feature responsive closed loop temperature control with LED readout set & operating temperature and an instant-rise internal vacuum pump. Zero voltage thyristor insures that no high voltage spikes or magnetic fields will be present on the soldering or desoldering tip. An ergonomically designed handpiece for solder reflow of PLCC surface mount devices with temperature controlled high thermal mass heaters target the heat to the leads without causing damage to the adjacent component or board. New stop clog filter remove flux fumes and other foreign matter before contamination of the internal pump. The EX-755 is the most advanced digital controlled SOLDER and SMT REMOVAL STATION. This station is used for critical temperature, high capacity production soldering on all surface mount and thru hole components. A programmable, digital controller regulates temperature of the solder iron, providing a continuous display of the operating temperature clear LED readout. The SMD Digitally Controlled Installation and Removal of Small SOIC/PLCC type components provides a controlled temperature to Reflow Solder and a Rapid Cool Down. This system avoids Thermal Shock; unwanted heating and crystallization of adjacent solder joints and affords the user total process control. |
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