Standard
System Includes:
- Ex-1700 Desoldering
Handpiece
- Power supply
with digital temperature control and single holder assembly with
wet and dry wipe cleaning station.
- Cleaning
Brushes
- PNEU-VAC
Foot Pedal
- Sample Tip
Kit
The Quik Plate
System allows you to clean and electro-plate printed circuit boards
and electronic assemblies. Standard supplies include gold solution,
nickel solution and electro clean. Available optionally are tin,
lead, copper and silver plating solutions. See plating supplies
replacement parts in A.P.E.'s Parts Book and Engineering Data.
The SRS-069
which has both a voltage and current control, is microprocessor
controlled which automatically adjusts voltage and current control
for depletion in solution for military specification plating.
The Quick Plate
SRS-069 is a low power system. The control circuit is a precision
voltage source where the output voltage controls the activation
of the plating solution. This voltage is controlled to greater than
three percent by the internal regulator.
The current
control on the SRS-069 determines the rate and the amount of plating
that is deposited. The current is a precision current source that
insures uniform plating and when set, will not allow burning or
arcing. The precision current source uses a high gain operational
amplifier integrated circuit. The current control setting changes
the gain of the difference amplifier and when the setting and current
are the same the amplifier controls the regulator from supplying
any more current.
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Model EX-680
Specifications
- 115 vac,
50/60 Hz 35W
- 6"
L x 5" W x 2.75" H
- (15.24 cm
L x 12.70 cm W x 6.985 cm H)
- Part No.
0680-0000
- 220/240 vac,
50Hz 35W
- 6" L
x 5" W x 2.75" H
- (15.24 cm
L x 12.70 cm W x 6.985 cm H)
- Part No.
0680-2000
Plating
Material
|
Application
|
Nickel
|
PC board
edge connectors and other device contacts for excellent conductivity
without corrosion. |
|
Gold
|
Between
base copper and overplate of gold to prevent copper migration.
Overplating on mild steel. |
|
Operational
Plating Copper High Speed
|
Fast buildup
over 0.0003 to 0.0005 in. thick Copper High Speed copper alkaline. |
|
Copper
Alkaline
|
Thin buildup
over aluminum or mild steel. |
|
Tin-Lead
Tin-Plating
|
Directly
over base copper materials. Tin-Plating Alone for solderable
surfaces or underplating for tin-lead. |
|