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Improved
Alignment
Research has
verified that increasing the available power during reflow has two
significant effects:
- Increased
Power availability reduces the necessary air temperature needed
to Reflow.
- A reduction
in Reflow Temperature results in higher solder viscosity, producing
improved alignment characteristics for BGA and SMT components.
These two
important effects produce the following important advantages:
- Reduced component
and board stress
- Prevent the
possibility of scorching
- Assist in
the prevention of bridging between contacts
- Help align
BGA components more comfortably
Linear Air
Delivery
The Heat Acceleration
Chamber and delivery Nozzle Block are designed to provide maximum
air spin of the air flow to the nozzle, ensuring minimal temperature
differences across wide area packages, important for linear reflow
of CCBGA and larger devices.
Flo-Master-Z Order Information:
- 5000-2000-Z Flo-Master 110v Z-Axis
Unit Includes: Power Supply 110v, Reflow Head with 2.500" of Z-Axis travel
(1200watts), Integrated Localized Pre-Heat System (600watts), Digital
Controller with all 4 modes of operation, 8" x 12" Frame Holder on linear
rails, Self-Contained Vacuum IC removal device, SMD Tool Kit, Halogen Light
w/ mounting bracket, Chipmaster T and Sniper Demonstration video, Foot
Pedal, Power Cord, three user-selected Reflow nozzles, and two user selected
pre-heat nozzles.
- 5000-2002-Z Flo-Master 220v Z-Axis
Unit Includes: Power Supply 220v, Reflow Head with 2.500" of Z-Axis travel
(1200watts), Integrated Localized Pre-Heat System (1200watts), Digital
Controller with all 4 modes of operation, 8" x 12" Frame Holder on linear
rails, Self-Contained Vacuum IC removal device, SMD Tool Kit, Halogen Light
w/ mounting bracket, Chipmaster T and Sniper Demonstration video, Foot
Pedal, Power Cord, three user-selected Reflow nozzles, and two user selected
pre-heat nozzles.
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Benefits:
- Enables true
reverse manufacture rework
- Low Temperature
removal of components
- Maintains
integrity of existing solder
- Automatic
removal of components at eutectic stage
- All types
of PCB products accommodated
- Total area,
simultaneous reflow of component
- Run continuous
or pulsed
- Rework soft
plastics and sensitive components requiring short heat cycles.
Specifications:
- Power: 110V-1800
Watts, 220VŠ2400 Watts
- Current:
16.36 Amps @ 110V, 10.91 Amps @ 220V
- Dimension:
26" x 12.75" x 16" (660 x 324 x 406 mm)
- Board Holder:
Standard 8"x12" (203 x 304 mm)
- 3 Reflow Nozzles
included: (User may select alternatives)
- 2 Preheat Nozzles:
- Air Velocity:
(Both Heaters) <12.7 CFM
- Vacuum: Internal
(Optional factory Air)
- Air Source:
Internal
- Controller
(Both Heaters): Fuzzy logic PID Profile Storage
- 4-Axis X-Y
Table Built In: 19.0" x 15.50" (482.6 x 393.7 mm)
- Operation:
Pulsed or Continuous
- Maximum Board
Size: 32" x 24"
Preheat
A bottom preheat
and in-process heat source, ensures stability of board temperature,
reducing the necessary top reflow temperature, thereby following
a more precise profile structure for the component undergoing rework.
Temperature
Profiles
A range of temperature
profiles are installed for bottom and top controllers and each thermal
profile may be custom programmed, enabling different combinations
of preheat and removal temperatures to be selected.
Mechanical
Control
The Flo-Master
has been engineered to operate on a standard workbench and includes
a built-in X-Y Table for precise alignment. Each of the axis can
be locked for optimum control.
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