Sniper Split Vision System...SMD-7007

Overview

The Sniper Flo-Master, SMD-7007 combines the unique High Power, Low Temperature, reflow operation of APE's Flo-Master with the latest technology in optic engineering and alignment design. The SMD-7007 provides absolute control in positioning all ultra fine pitch, and BGA packaging technologies including Flip Chip bumped packages.

Dabis

A Dichroic Alignment Beam Image Splitter (DABIS) is a contemporary innovation in imaging dual fields to enhance and compliment the processed view

Over the Top

A Dabis (Dichroic Alignment Beam Image Splitter) permits the contact array of the component to be viewed from the underside and super imposed over an image of the contact land pattern on the PCB or substrate.

Component Registration

Precision micrometers align the two lead patterns and a position focus provides for high magnification alignment.

Free and Clear

Once registered, the component is automatically positioned by pneumatic control, lifting the vision system clear of the placement vector and allowing a precise Vertical Placement Drive (VPD) to accurately orient the component to the contact land pattern.

Focus and Split

Unlike other systems, Sniper technology finally makes it possible to view many different sizes of components without resetting mirrors or aligning optics, which can waste a great deal of time in the initial set up to place, perhaps, just one component. With the Sniper, you simply Focus and Split.....that's it.

Vacuum Pick-Up

A Vacuum Pick-Up system supports the component during the registration alignment and automatically releases the component during placement

Vertical Placement Drive (VPD)

When placing delicate components to fine tolerances, emphasis on stability of engineering is a priority. The reinforced VPD provides a stable final positioning operation and is adjustable in the Z-axis for pressure sensing.

Rotary/Staged Vacuum Board Holder

The SMD-7007 includes a standard 12" x 16" (305mm x 406mm) vacuum actuated board holder, which quickly glides to position. Precision micrometers adjust in X and Y-axis and the "Rotary/Staged" feature of the table provides "Theta". Optional board holders are available for smaller and larger board types.

Features:

• Registration without mirror adjustment for components 0.25" Sq. To 2.75" Sq.
• Automatic placement
• Component templates for fast registration
• Vacuum pick-up of component
• X, Y, Z and Theta Micrometer adjustments
• Vacuum actuated "Rotary board holder"
• High Resolution Camera and 19" monitor for 10-80x viewing
• Widest range of component types accommodated from micro BGA's to high pin count Ceramic BGA's including Flip Chips
• Proven integrated High Power, Low Temperature BGA rework system