Bondmaster LCD Repair - HSC-Heat Sealed Connector/LCD Bonding System and Hot Bar Reflow

Overview

BondMaster with Universal Bonding Fixture-high thermal mass heater with "Super Flat" floating alignment design ensuring repeatable accuracy for consistent bonding. An economic and proven bonding system for Pager and Portable Radio Liquid Crystal Displays, PCMCIA, Heat Seal Connectors and Hot Bar Reflow Soldering.

The BondMaster's optimum Hot Bar Temperature Controller offers accurate and reliable temperature time cycle control. This is accomplished by a thermocouple sensor that is located directly within the Bonding Bar. The close-loop operation is calibrated to given operating characteristics and continually compensates for "Set-Point" of temperature drop and over shoot. This eliminates thermal stress, delimitation and heat degradation, providing a major advantage in the reliability of the bonded components.

See some of the many reflow profiles that can be created and stored with BondMasters microprocessor control:

• Straddle mount hairpin or flat heads
• Minimum localized heat
• No solder bridges

Features:

• HSC, Mylar, PCMCIA soldering connections
• Microprocessor controlled
• Self-contained, no PC or factory air required
• Linear pressure control
• Precise temperature control with ramping
• Repeatable process control
• Continuous or pulse operation
• Prestored profile groups (User Programmable)
• Floating and self-aligning bonding head
• Thermal bonding reservoir
• "Super Flat" bonding surface
• Thermal Stability throughout bonding cycle
• No silicone barrier required

Process Control Programmable Features:

• Ramp rate degrees/sec
• Ramp rate time vs. Temp
• Programmable set point Centigrade or Fahrenheit
• Ramp time 45 sec to 20 sec