| Sniper III Split Vision Rework System |
| The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile
generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor the
component, board and environment. A 17" monitor reflects the image of the bottom of the chip and the footprint on the board,
these images are then adjusted to exactly overlay each other and the component placed automatically. |
Energy Reflow - DABIS Prism
The Sniper III Vision Rework system combines Closed-Loop energy reflow control that precisely measures the temperature of the heated air and the very latest technology in optic alignment design. These features provide absolute control in position- ing all ultrafine pitch, Micro BGA, QFP, and CSPs (Chip Scale Packages), together with large ceramic or plastic BGA devices. |
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| A Dichroic Alignment Beam Image Splitter (DABIS) is a contemporary innovative refinement in imaging dual fields using a split prism to enhance and clarify the image. |
| Once aligned, the component is automatically positioned by pneumatic control, lifting the camera system clear of the placement vector. A Vertical Placement Drive (VPD) accurately orients the component to the contact land patten. |
A Venturi Vacuum Pick-Up system supports the component during alignment and automatically snap releases the component during placement. |
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Look Up Look Down - The DABIS Prism permits the contact array of the component to be viewed from the underside and superimposed over an image of the contact land pattern on the PCB. Component Alignment Precision Micrometers align the two lead patterns; the camera's zoom and focus are adjusted to comfortably align and view the PCB and component on the monitor. Focus and Split Using a prism simplifies the alignment procedure and ensures repeatability during continuous operation.
It is also possible to view many different types of components without additional setup. To view the diagonal corners of very large components, an optional Macro Imager 7000-2500 can be inserted when required. Vertical Placement Drive (VPD) When placing delicate components to fine tolerances, emphasis on stability of engineering is a priority, the reinforced VPD provides a stable final positioning operation, and is adjustable in the Z-axis for pressure sensing.
Rotary/Staged Vacuum Board Holder - The Sniper III includes a standard 12" x 16" (305 x 406 mm) vacuum actuated Board Holder, which quickly glides to position. Precision micrometers adjust in X- and Y-axis and the "Rotary/Staged" feature of the table provides "Theta." Optional Board Holder Extender Kits are available for smaller and larger board types. |
Sniper III Specifications:
- Power
110220V 1800 Watts
- Current
25 Amps @ 110V, 15 Amps @ 220V
- Dimension
21.75" x 29.12" (552 x 740 mm)
- Board Holder Standard
12" x 16" (305 x 406 mm)
- Reflow Nozzles included
Six Nozzles of Choice with 12 months free exchange
- Preheat Nozzles included
All included
- Temperature
Select Celsius or Fahrenheit
- Reflow Air Velocity
Internal Motor < 12.7 CFM
- Component Pick Up
Venturi Generator Reflow & Imaging
- Factory Air
60-80 psi for Placement System
- Controller
On Board Computer
- Profile Generation
Pentium IV with 17" Monitor included
- Board Alignment
Micrometer Controls
- Reflow Operation
Close Loop
- Maximum Board Size
16" x 20"(406 x 508 mm)
- Air Flow
Up to 1 SCFM
- Weight
165 lb (75 kg)
- Communication
RS232 Sniper II Only
- Operational Software
On Board Computer and Specview Graphic Display
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Widest range of component types accommodated from Micro BGAs to high pin count Ceramic CBGA · Board sizes up to 16" X 18" (406 x 457 mm) · Low Temperature Technology On-Board Computer The Sniper III can be operated with- out an external computer directly from the on-board computer, which can run pre programmed profiles or patterns.
 The Bottom Heater is auto- matically controlled by the on-board computer ensuring complete process control. Profile Control The Sniper III stores up to sixteen (16) multi segment (Ramp & Soak) profiles on the machine or any number of profiles by using Windows-based software. Programs can be created and entered directly on the Reflow Controller keypad or created using Graphical Display software (included).
Data Logging events is provided in PDF format. The rework cycle is automatically controlled and shut off after completion. Graphical Display Window (GDW) The computer software provided operates in a Windows-based environment. Profile Pattern Recipes are easily created, stored, recalled, and edited using a Graphical Display Window (GDW). |
