Chipmaster SMD-1000

Descripción

De los enchufe de plasticos a los BGA componentes de cerámica, el Chipmaster SMD-1000 proporciona un ambiente controlado del la reanudacion que cuide para su proceso de la reparacion. La operacion simple de las caracteristicas con automatico " sincronizado" de control de proceso y selecciono perfilar termal.

From plastic sockets to ceramic BGA components, the Chipmaster SMD-1000 Rework Engine provides a controlled rework environment which cares for your repair process. Features simple operation with automatic "Timed" process control and selected thermal profiling.

Cost Effective

With the proliferation of new packaging technology and costly SMT PCB'S, rework challenges have developed to safely repair and rework boards with repeatable process control. In 1991 A.P.E. introduced the ultimate cost effective SMT solution....The Chipmaster!

Power Reflow

What makes the Chipmaster different from other Hot Air rework machines? "POWER"...Its 1200-Watt heater reworks sensitive components at original Convection Oven temperatures, typically less than 450°F (232°C), thereby reducing the temperature to the component and surrounding area.

¿Qué hace el Chipmaster diferente de otras máquinas? "POWER".... Su  calentador 1200-vatio vuelve a trabajar componentes sensibles en las temperaturas originales del horno de la convección, tipicamente menos que 450°F (232°C), de tal modo reduciendo la temperatura a los alrededores components y.

Low Temperature Advantage

The advantages of this patented design have only recently become recognized, particularly with the research into BGA sphere behavior under differing temperatures. For example, the lower the temperature, the greater the viscosity of the sphere, therefore, it follows that the greater the viscosity, the more definite the alignment characteristics of the sphere during reflow.

Ventaja De la Baja Temperatura

Las ventajas de este diseño patentado solamente rcientemente se han reconocido, particularmente con la investigación en comportamiento de la esfera de BGA bajo temperaturas que diferenciaban. Por ejemplo, cuanto más baja es la temperatura, cuanto mayor es la viscosidad de la esfera, por lo tanto, sique que cuanto mayor es la viscosidad, mas definidas las características de la alineacíon de la esfera durante flujo.

Solder Integrity 

The following micro sections indicate the superior quality of a solder junction when operating at a Low Temperature using the Chipmaster.

 Soldar Integridad

Las secciones micro siquientes indican la calidad superior de una ensambladura de la soldadura al funcionar en una baja temperatura usando el Chipmaster 

New Chipmaster Training Video!    Enlarge Photo    (Picture 1)    (Picture 2)    (Picture 3)

Wide Ranging

Work on traditional SMT components to the newest style BGA's!

Specifications:

• Power 1200 Watts
• Current 10.90 Amp @ 110V, 5.45 Amps @ 220V
• Dimension 22.25" x 9.25" x 8.62" (362 x 235 x 219 mm)
• Board Holder Standard 8" x 8" (203 x 203 mm)
• Nozzles included: (User may select alternatives)
• 8100-0000-44 0.80" x 0.80" (20.3 x 20.3 mm)
• 8100-1424 0.71" x 0.40" (18.0 x 10.2 mm)
• 8100-1075 1.00" x 0.75" (25.4 x 19.0 mm)
• Temperature Celsius or Fahrenheit
• Air Velocity <12.7 CFM
• Vacuum Internal Pump
• Air Souce Internal Blower
• Controller Fuzzy logic PID