With the proliferation
of new packaging technology and costly SMT PCB'S, rework challenges
have developed to safely repair and rework boards with repeatable
process control. In 1991 A.P.E. introduced the ultimate cost effective
SMT solution....The Chipmaster!
What makes the
Chipmaster different from other Hot Air rework machines? "POWER"...Its
reworks sensitive components at original Convection
Oven temperatures, typically less than 450°F (232°C), thereby
reducing the temperature to the component and surrounding area.
of this patented design have only recently become recognized, particularly
with the research into BGA sphere behavior under differing temperatures.
For example, the lower the temperature, the greater the viscosity
of the sphere, therefore, it follows that the greater the viscosity,
the more definite the alignment characteristics of the sphere during
micro sections indicate the superior quality of a solder junction
when operating at a Low Temperature using the Chipmaster.
400 to 450°F (204 to 221°C) Convection temperature
integrity of solder remains intact.
low power rework temperatures
>475°F integrity of solder begins to break down, this
is a problem with other rework systems.
Work on traditional
SMT components to the newest style BGA's!
- Power 1200
- Current 10.90
Amp @ 110V, 5.45 Amps @ 220V
22.25" x 9.25" x 8.62" (362 x 235 x 219 mm)
- Board Holder
Standard 8" x 8" (203 x 203 mm)
- Nozzles included:
(User may select alternatives)
0.80" x 0.80" (20.3 x 20.3 mm)
0.71" x 0.40" (18.0 x 10.2 mm)
1.00" x 0.75" (25.4 x 19.0 mm)
Celsius or Fahrenheit
- Air Velocity
- Vacuum Internal
- Air Souce
Fuzzy logic PID